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BergStik® 2.54mm - Unshrouded Headers - Double Row - Vertical - Surface Mount

Overview

Overview

FEATURESBENEFITS
  • High temperature thermoplastic material
  • Reflow compatible
  • Variable spacing height for stacking headers
  • Cater to a wide range of applications
  • Allow dual entry; mating from top or bottom
  • Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
  • Blank 0.64mm square contacts presents 4 surfaces of equal quality
  • Can be used for wire wrapping
  • Standoff design
  • Allows cleaning to remove soldering contamination
  • Duplex plating
  • Cost-efficient
  • Tin-lead plating in press-fit area
  • Easy pin insertion onto PCB
  • Retention legs option
  • High retention force onto PCB
  • Press-fit designed to fit 1.02mm diameter hole, solder-toboard product
  • Same layout on THT and press-fit
  • Meets DIN 41651 specification, HE13 and BT D2632
  • Qualified product
Target Market / Application
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Documentation
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Part Numbers

Part Numbers

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Plating Contact area
  1. 0.38μm (15μinch) Gold 1 item
  2. 0.76μm (30μinch) Gold 1 item
  3. Tin 1 item
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Part Number Description Product Drawing Status
BergStik®

Unshrouded vertical header, Surface mount, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch.

Product Drawing Check Stock
BergStik®

Unshrouded vertical header, Surface mount, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch.

Product Drawing Check Stock
BergStik®

Unshrouded vertical header, Surface mount, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch.

Product Drawing Check Stock
View as Grid List

3 Items

per page
Set Descending Direction
Test Report

Test Report

Kindly contact Amphenol ICC for test report.

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