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BergStik® 2.54mm - Stacking Headers - Double Row - Through Mount

Overview

Overview

FEATURESBENEFITS
  • High temperature thermoplastic material
  • Reflow compatible
  • Variable spacing height for stacking headers
  • Cater to a wide range of applications
  • Allow dual entry; mating from top or bottom
  • Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
  • Blank 0.64mm square contacts presents 4 surfaces of equal quality
  • Can be used for wire wrapping
  • Standoff design
  • Allows cleaning to remove soldering contamination
  • Duplex plating
  • Cost-efficient
  • Tin-lead plating in press-fit area
  • Easy pin insertion onto PCB
  • Retention legs option
  • High retention force onto PCB
  • Press-fit designed to fit 1.02mm diameter hole, solder-toboard product
  • Same layout on THT and press-fit
  • Meets DIN 41651 specification, HE13 and BT D2632
  • Qualified product
Target Market / Application
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Test Report

Test Report

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